Laser processing device, laser processing temperature measuring device, laser processing method and laser processing temperature measuring method,申请号EP20100177834-传众专利搜索

Laser processing device, laser processing temperature measuring device, laser processing method and laser processing temperature measuring method

申请公布号：EP2255919(A3)

申请号：EP20100177834

申请日期：2003.06.18

申请公布日期：2014.08.20

申请人：

HAMAMATSU PHOTONICS K.K.

发明人：MATSUMOTO, SATOSHI;KOSUGI, TSUYOSHI

分类号：B23K26/00;B23K26/06;B23K26/03;B23K26/32;B23K26/40;B23K26/42;B29C65/00;B29C65/16;G01J5/06;H01S3/00

主分类号：B23K26/00

摘要：The object is to provide a laser processing apparatus, a laser processing temperature measuring apparatus, a laser processing method, and a laser processing temperature measuring method which can highly accurately detect the processing temperature when carrying out processing such as welding with laser light. A laser processing apparatus 1A for processing members DR, UR to be processed by irradiating the members with laser light LB comprises a laser (semiconductor laser unit 20A) for generating the laser light LB; optical means for converging the laser light LB generated by the laser onto processing areas DA, UA; and a filter 30, disposed between the members DR, UR to be processed and the optical means, for blocking a wavelength of fluorescence generated by the optical means upon pumping with the laser light LB; wherein light having the wavelength blocked by the filter 30 is used for measuring a temperature of the processing areas DA, UA. <IMAGE>