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CU-ZN ALLOY STRIP FOR TAB MATERIAL FOR CONNECTING CELLS

申请公布号:KR101414882(B1)

申请号:KR20127028279

申请日期:2011.03.25

申请公布日期:2014.07.03

分类号:C22C9/04;C22F1/02;C22F1/08;C25D7/00

主分类号:C22C9/04

摘要:Provided is a Cu-Zn alloy strip which is a copper alloy containing 2-12 mass% Zn, with the remainder comprising Cu and incidental impurities, and in which the frequency of twin-crystal boundaries is 40-70%. The alloy strip has satisfactory resistance to repeated flexing and satisfactory weldability and is suitable for use as a tab material for connecting rechargeable cells. The alloy strip may further contain 0.1-0.8 mass% Sn, and may have an aspect ratio of 0.3-0.7 in terms of aspect ratio between crystal grain diameter in the direction parallel to the rolling direction and crystal grain diameter in a direction perpendicular to the rolling direction. The alloy strip may further contain at least one of Ni, Mg, Fe, P, Al, and Ag in a total amount of 0.005-0.5 mass%. Also provided is a Sn-plated Cu-Zn alloy strip which is obtained by plating the Cu-Zn alloy with Sn in a thickness of 0.3-2 µm.

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