申请公布号：JP5456465(B2)

申请号：JP20090517722

申请日期：2008.06.03

申请公布日期：2014.03.26

分类号：B29C33/40;B29C59/02;H01L21/027

主分类号：B29C33/40

摘要：<p>A mold 100 for imprinting has a mold pattern 2A for transferring a pattern to a processing object. A base layer 1 having a predetermined base pattern 1A is formed by imprinting on a thermoplastic resin, a thermosetting resin, a photo-curable resin, or the like, and a mold layer 2 is formed in such a way that the mode pattern 2A is shapened along a surface of the base pattern 1A by a surface preparation technique, such as CVD, PVD, or plating. Accordingly, there is provided a mold which has the same functions as those of conventionally-used silicon mold and metal mold and which facilitates manufacturing thereof.</p>

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