Semiconductor package, method of manufacturing the same and package-on-package,申请号KR20120056342-传众专利搜索

Semiconductor package, method of manufacturing the same and package-on-package

申请公布号：KR101362715(B1)

申请号：KR20120056342

申请日期：2012.05.25

申请公布日期：2014.02.13

分类号：H01L23/48

主分类号：H01L23/48

摘要：<p>The present invention provides a semiconductor package including an accurate through line with a low process defect, and a method for manufacturing the same. According to one embodiment of the present invention, the semiconductor package includes an insulating substrate including a first through part and a second through part; a through line penetrating the insulating substrate; an upper pad electrically connected to the upper part of the through line and located on the upper surface of the insulating layer; a lower pad electrically connected to the lower part of the through line and located on the lower surface of the insulating substrate; a semiconductor chip electrically connected to the through line and located in the second through part; a molding member molding the insulating substrate and having a firs side covered by the insulating substrate and a second side exposed from the insulating substrate; and a redistribution pattern layer electrically connected to the semiconductor chip and the through line and located on the lower part of the insulating substrate.</p>