HOUSING FOR ELECTRONIC APPARATUS

申请公布号：JP2013171845(A)

申请号：JP20120032743

申请日期：2012.02.17

申请公布日期：2013.09.02

申请人：

PANASONIC CORP

发明人：KAWAMURA EIJI

分类号：H05K7/20

主分类号：H05K7/20

摘要：PROBLEM TO BE SOLVED: To provide a housing for an electronic apparatus, capable of efficiently dissipating heat of an electronic substrate on which an electronic component having a heat-generating property is mounted.SOLUTION: A housing (1) for an electronic apparatus has a first side surface pair and a second side surface pair which are composed of two side surfaces (112, 113) of a resin material facing each other. An electronic substrate (21) is carried at a predetermined height position by a receiving part (114) formed of the resin material inside one of the side surfaces and is press-fixed by a claw part (115) formed of the resin material inside one of the side surfaces.

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