CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTROOPTICAL DEVICE,申请号US201313748109-传众专利搜索

CIRCUIT SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND ELECTROOPTICAL DEVICE

申请公布号：US2013200401(A1)

申请号：US201313748109

申请日期：2013.01.23

申请公布日期：2013.08.08

申请人：

JAPAN DISPLAY WEST INC.;JAPAN DISPLAY WEST INC.

发明人：TAKEUCHI SHUNPEI;OTA AKIO;MIZUNO MANABU;HIROSE TAKAYA

分类号：H01L27/12;H01L21/768;H01L27/146;H01L27/15

主分类号：H01L27/12

摘要：A circuit substrate includes, on an insulating substrate, a plurality of devices, a plurality of conductive layers connected in one-to-one correspondence with the devices, and an insulating layer provided between the devices and the conductive layers. The insulating layer includes a first insulating layer covering the devices, a second insulating layer formed on the first insulating layer, and a plurality of contact holes each passing through the first and second insulating layers in a thickness direction thereof. Side surfaces of the first and second insulating layers contact each other in at least part of the inside of each contact hole. Each conductive layer extends along an upper surface of the second insulating layer, at least a part of a side surface of the contact hole in which the side surfaces of the first and second insulating layers contact each other, and a bottom surface of the contact hole.