Light emitting diode package and light emitting diode module,申请号US20100980358-传众专利搜索

Light emitting diode package and light emitting diode module

申请公布号：US8502250(B2)

申请号：US20100980358

申请日期：2010.12.29

申请公布日期：2013.08.06

申请人：

LIN MING-TE;LIN MING-YAO;TAI SHENG-CHIEH;LIU CHIH-HSUAN;TAI KUANG-YU;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人：LIN MING-TE;LIN MING-YAO;TAI SHENG-CHIEH;LIU CHIH-HSUAN;TAI KUANG-YU

分类号：H01L33/60;H01L33/08

主分类号：H01L33/60

摘要：A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.