Device Including Two Power Semiconductor Chips and Manufacturing Thereof,申请号US201113314438-传众专利搜索

Device Including Two Power Semiconductor Chips and Manufacturing Thereof

申请公布号：US2013146991(A1)

申请号：US201113314438

申请日期：2011.12.08

申请公布日期：2013.06.13

申请人：

OTREMBA RALF;HOEGLAUER JOSEF;MAHLER JOACHIM;LODERMEYER JOHANNES;INFINEON TECHNOLOGIES AG

发明人：OTREMBA RALF;HOEGLAUER JOSEF;MAHLER JOACHIM;LODERMEYER JOHANNES

分类号：H01L25/07;H01L21/60;H01L23/538

主分类号：H01L25/07

摘要：A device includes a first power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The device further includes a second power semiconductor chip with a first contact pad and a second contact pad on a first face and a third contact pad on the second face. The first and second power semiconductor chips are arranged one above another, and the first face of the first power semiconductor chip faces in the direction of the first face of the second power semiconductor chip. In addition, the first power semiconductor chip is located laterally at least partially outside of the outline of the second power semiconductor chip.