WOODEN FLOOR MATERIAL AND MANUFACTURING METHOD THEREOF,申请号JP20110205155-传众专利搜索

WOODEN FLOOR MATERIAL AND MANUFACTURING METHOD THEREOF

申请公布号：JP2013067947(A)

申请号：JP20110205155

申请日期：2011.09.20

申请公布日期：2013.04.18

申请人：

PANASONIC CORP

发明人：NAKAGAWA MASAHIRO;MORI KENJI

分类号：E04F15/08

主分类号：E04F15/08

摘要：<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wooden floor material which has high scratch resistance, hardly causes warpage, and prevents damage when dried. <P>SOLUTION: A wooden floor material comprises a gypsum board 1 and a medium density fiberboard 3 which is bonded to the surface of the gypsum board 1 with a hot-melt adhesive. The medium density fiberboard 3 has a thickness equivalent to 17 to 22% of the total thickness of the wooden floor material. The medium density fiberboard 3 bonded to the surface of the gypsum board 1 has a water content in the range of 2 to 6%. <P>COPYRIGHT: (C)2013,JPO&INPIT