Luminescence device and method of manufacturing the same
申请公布号:KR101221642(B1)
申请号:KR20120020457
申请日期:2012.02.28
申请公布日期:2013.02.05
分类号:H01L33/48
主分类号:H01L33/48
摘要:PURPOSE: A light emitting device and a manufacturing method thereof are provided to prevent the damage of a semiconductor layer due to pressurization by manufacturing a host substrate in outside and omitting a pressurized bonding process. CONSTITUTION: A semiconductor layer is formed on a growth substrate. The semiconductor layer comprises an n-type semiconductor layer(120), an active layer(130), and a p-type semiconductor layer(140). A buffer layer is formed in the lower side of the n-type semiconductor layer. A transparent electrode layer(150) is formed on the p-type semiconductor layer. A metal layer(155) for bonding is formed on the transparent electrode layer. A first metallic coating layer(180) is formed on the metal layer. A second metallic coating layer(190) is formed on the first metallic coating layer.
ELEKTROMAGNETISCHER DREHSTELLER
VERFAHREN ZUR HERSTELLUNG VON ANTIKOERPERN GEGEN HUMANKARZINOME
PROJEKTIONS-FAHRZEUGSCHEINWERFER
QUINOLINE DERIVATIVE AND PRODUCTION THEREOF
AUTOMATIC CLEANER FOR CONCRETE MOLD
FLUX CORED WIRE FOR GAS SHIELDED ARC WELDING
PRINTER HAVING AUTOMATIC ADJUSTING FUNCTION FOR LEFT MARGIN BLANK
COMMUNICATION NETWORK INTERCONNECTOR
TABLE REFERRING SYSTEM FOR FILE
TOOL ABNORMALITY DETECTING METHOD
SHOVEL TYPE EXCAVATOR HAVING FOLD ARM
AUTOMOBILE WINDSHIELD CLOUD REMOVING DEVICE
CORE GROOVE INSULATING UNIT FOR ELECTRIC ROTATING MACHINE