COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION

申请公布号：US2013021765(A1)

申请号：US201213626943

申请日期：2012.09.26

申请公布日期：2013.01.24

申请人：

KONINKLIJKE PHILIPS ELECTRONICS N.V.;VAN VEEN NICOLAAS JOHANNES ANTHONIUS;BIGLARI HOSSAIN MOHAMMAD

发明人：VAN VEEN NICOLAAS JOHANNES ANTHONIUS;BIGLARI HOSSAIN MOHAMMAD

分类号：B23K31/02;B23K35/02;B23K35/26;B23K35/28;B32B15/04;H05K1/18;H05K3/34

主分类号：B23K31/02

摘要：The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.

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