Reducing metal pits through optical proximity correction
申请公布号:US8341562(B1)
申请号:US201113188166
申请日期:2011.07.21
申请公布日期:2012.12.25
发明人:HUANG JIUN-JIE;LIN CHI-YEN;WANG LING-SUNG
分类号:G06F17/50
主分类号:G06F17/50
摘要:A method includes retrieving first layouts of an integrated circuit from a non-transitory computer-readable medium. The first layouts include a via pattern in a via layer, and a metal line pattern in a metal layer immediately over the via layer. The metal line pattern has an enclosure to the via pattern. The enclosure is increased to a second enclosure to generate second layouts of the integrated circuit.
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