Bonding Method and Bonded Body,申请号US201213533521-传众专利搜索

Bonding Method and Bonded Body

申请公布号：US2012315450(A1)

申请号：US201213533521

申请日期：2012.06.26

申请公布日期：2012.12.13

申请人：

YAMAMOTO TAKATOSHI;SATO MITSURU;ASUKE SHINTARO;MORI YOSHIAKI;GOMI KAZUHIRO;SEIKO EPSON CORPORATION

发明人：YAMAMOTO TAKATOSHI;SATO MITSURU;ASUKE SHINTARO;MORI YOSHIAKI;GOMI KAZUHIRO

分类号：B32B37/12;B32B3/10;B32B37/06

主分类号：B32B37/12

摘要：A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.