Semiconductor device having electrical fuses with less power consumption and interconnection arrangement,申请号US20100723218-传众专利搜索

Semiconductor device having electrical fuses with less power consumption and interconnection arrangement

申请公布号：US8331185(B2)

申请号：US20100723218

申请日期：2010.03.12

申请公布日期：2012.12.11

申请人：

OBAYASHI SHIGEKI;YONEZU TOSHIAKI;IWAMOTO TAKESHI;KONO KAZUSHI;ARAKAWA MASASHI;UCHIDA TAKAHIRO;RENESAS ELECTRONICS CORPORATION

发明人：OBAYASHI SHIGEKI;YONEZU TOSHIAKI;IWAMOTO TAKESHI;KONO KAZUSHI;ARAKAWA MASASHI;UCHIDA TAKAHIRO

分类号：G11C17/18

主分类号：G11C17/18

摘要：In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.