Cooling apparatus for semiconductor element,申请号US20100943417-传众专利搜索

Cooling apparatus for semiconductor element

申请公布号：US8331092(B2)

申请号：US20100943417

申请日期：2010.11.10

申请公布日期：2012.12.11

申请人：

KAWAURA MASANORI;MATSUI HIROHITO;YOSHIDA TADAFUMI;TOYOTA JIDOSHA KABUSHIKI KAISHA;NIPPON SOKEN, INC

发明人：KAWAURA MASANORI;MATSUI HIROHITO;YOSHIDA TADAFUMI

分类号：H05K7/20;F28D7/00;H01L23/34

主分类号：H05K7/20

摘要：A semiconductor element cooling apparatus includes: a first member whose first surface on which a semiconductor element is mounted, and whose second surface has fins that define coolant flow paths, and that extend in a first direction, and that stand from the second surface to a predetermined height, and that are spaced from each other by predetermined intervals; and a second member that defines the coolant flow paths that extend in the first direction. The fins have grooves which extend in a second direction that intersects the first direction, and which have a depth that extends from the distal end side of the fins toward the second surface. The depth of the grooves is smaller than the height of the fins. A protrusion-forming member is disposed in the grooves, and extends across adjacent fins, and forms protrusions in the coolant flow paths defined by the adjacent fins.