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Plasma mediated processing of non-conductive substrates
申请公布号：US8318265(B2)
申请号：US20080137816
申请日期：2008.06.12
申请公布日期：2012.11.27
发明人：SCHERER BRIAN JOSEPH;ERLAT AHMET GUN;YAN MIN
分类号：H05H1/24
主分类号：H05H1/24
摘要：Methods for improving coating or etching uniformity of non-conductive substrates in plasma-mediated processes generally include applying an electrically conductive coating to the non-conductive substrate prior to plasma processing. The electrically conductive coating is disposed in electrical communication with a metallic electrode of a plasma reactor. By disposing a conductive layer on the non-conductive substrate, a uniform electric potential is created during plasma processing can be built up on the non-conductive, which is equivalent to that of the metallic electrode upon which it is disposed during plasma processing.
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