CERAMIC PRINTED CIRCUIT BOARD COMPRISING AN AL COOLING BODY
申请公布号:WO2012136579(A1)
申请号:WO2012EP55746
申请日期:2012.03.30
申请公布日期:2012.10.11
发明人:DOHN, ALEXANDER;THIMM, ALFRED
分类号:H01L23/367;F21V29/00;H01L23/373;H01L33/64
主分类号:H01L23/367
摘要:The invention relates to a ceramic printed circuit board (2) comprising an upper side (2a) and a lower side (2b), sintered metallisation regions being arranged on the upper side (2a), and the lower side being embodied as a cooling body (3). In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side (2b) is also provided with sintered metallisation regions to which a metal cooling body (3) is soldered.
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