Multilayered Structures and Methods of Making Multilayered Structures
申请公布号:US2012231216(A1)
申请号:US201213436974
申请日期:2012.04.01
申请公布日期:2012.09.13
发明人:ZIMMER JERRY WAYNE;CHANDLER GERARD JAMES
分类号:B32B3/10;B05D5/12
主分类号:B32B3/10
摘要:The present invention relates to a multilayered structure including at least one diamond layer and methods of making the multilayered structures. The multilayered structure includes a diamond layer having a top surface and a bottom surface, and when desired at least one metal filled via in the diamond layer, a first thin adhesion layer on the top surface, a second thin adhesion layer on the bottom surface, a first metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the first metal layer is deposited on the first thin adhesion layer, and a second metal layer having a thermal conductivity greater than 200 W/m-K and a coefficient of thermal expansion greater than 12 ppm/K, wherein the second metal layer is deposited on the second thin adhesion layer.