PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME,申请号US201213350203-传众专利搜索

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

申请公布号：US2012224335(A1)

申请号：US201213350203

申请日期：2012.01.13

申请公布日期：2012.09.06

申请人：

YUAN QIU;MAOHUA DU;YUCAI HUANG;LIQUN GU

发明人：YUAN QIU;MAOHUA DU;YUCAI HUANG;LIQUN GU

分类号：H05K7/06;H05K1/11

主分类号：H05K7/06

摘要：A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.