CONDUCTIVE PATTERN FORMATION SUBSTRATE AND MANUFACTURING METHOD THEREOF,申请号JP20110027569-传众专利搜索

CONDUCTIVE PATTERN FORMATION SUBSTRATE AND MANUFACTURING METHOD THEREOF

申请公布号：JP2012169082(A)

申请号：JP20110027569

申请日期：2011.02.10

申请公布日期：2012.09.06

申请人：

SHIN ETSU POLYMER CO LTD

发明人：KUNISHI YOSUKE;KOMATSU HIROTO;NISHIZAWA KOJI

分类号：H01B5/14;B32B7/02;G06F3/041;H01B13/00

主分类号：H01B5/14

摘要：<P>PROBLEM TO BE SOLVED: To provide a conductive pattern formation substrate capable of reducing wiring resistance of the routing wire in spite of the fact that a transparent conductive film contains conductive fibers. <P>SOLUTION: On the conductive pattern formation substrate, a first conductive pattern P<SB POS="POST">1</SB>and a second conductive pattern P<SB POS="POST">2</SB>are provided. The first conductive pattern P<SB POS="POST">1</SB>is provided by a first insulation pattern 14a constituted by a first insulation line B<SB POS="POST">1</SB>formed by removing the conductive fibers of the transparent conductive film in a transparent insulation material and forming gaps in portions where the conductive fibers exist. The second conductive pattern P<SB POS="POST">2</SB>is provided by a second insulation pattern 14b constituted of a second insulation line B<SB POS="POST">2</SB>formed by removing the transparent conductive film and a metal film. <P>COPYRIGHT: (C)2012,JPO&INPIT