INTEGRATED CIRCUIT AND RELAY BOARD,申请号JP20110017357-传众专利搜索

INTEGRATED CIRCUIT AND RELAY BOARD

申请公布号：JP2012160494(A)

申请号：JP20110017357

申请日期：2011.01.31

申请公布日期：2012.08.23

申请人：

JAPAN RADIO CO LTD

发明人：SHIROSAKI TOSHIBUMI

分类号：H01L27/04;H01L21/60;H01L21/822;H01L23/32;H03F3/189

主分类号：H01L27/04

摘要：<P>PROBLEM TO BE SOLVED: To provide an integrated circuit achieving multiple functions in a microwave band and a millimeter wave band by one integrated circuit and a relay board on which the integrated circuit is surface mounted, which can flexibly deal with a variety of different bandwidths without making a broadband design that causes property degradation. <P>SOLUTION: An integrated circuit comprises a plurality of circuits formed on a substrate individually, and a specific circuit formed distantly from the plurality of circuits on the substrate and capable of being connected to any one of the plurality of circuits. The specific circuit and the plurality of circuits have pads, respectively, served for connection with a surface-mounted relay board via bumps. <P>COPYRIGHT: (C)2012,JPO&INPIT