MOLD STRUCTURE FOR LIGHT-EMITTING DIODE PACKAGE,申请号US201113216913-传众专利搜索

MOLD STRUCTURE FOR LIGHT-EMITTING DIODE PACKAGE

申请公布号：US2012186848(A1)

申请号：US201113216913

申请日期：2011.08.24

申请公布日期：2012.07.26

申请人：

CHOI SUN;PARK JONG-JIN

发明人：CHOI SUN;PARK JONG-JIN

分类号：H05K5/02

主分类号：H05K5/02

摘要：A mold structure for a light-emitting diode (LED) package. The mold structure includes a notch, which is formed at at least an end portion of a package mold, in which a cavity is formed to mount a LED therein. Furthermore, an electrode lead, may be formed at at least an end portion of the package mold and may be closely attached to the package mold, and thus the overall size of a LED package may be reduced.