METHOD AND SYSTEM FOR DOUBLE-SIDED PATTERNING OF SUBSTRATES
申请公布号:EP1957249(A4)
申请号:EP20060844789
申请日期:2006.11.30
申请公布日期:2012.07.25
发明人:CHOI, BYUNG-JIN;SREENIVASAN, SIDLGATA V.
分类号:G03F7/00;B29C35/02;G03F9/00
主分类号:G03F7/00
摘要:The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.
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