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AUTOMATIC SHUTTER FOR ADHESIVE DISPENSER

申请公布号:US2012171372(A1)

申请号:US20100982755

申请日期:2010.12.30

申请公布日期:2012.07.05

申请人:
LOOI HK;CHEH CHENG-HAI;STMICROELECTRONICS PTE LTD.

发明人:LOOI HK;CHEH CHENG-HAI

分类号:B05D5/10;B05C5/00;B05C11/00

主分类号:B05D5/10

摘要:In automated gluing systems for semiconductor device manufacture, an automatic shutter system is provided for use with an adhesive dispenser that is configured to deposit adhesive for joining elements during final assembly processes. A shutter is configured to interpose itself between a needle tip of the dispenser and a working surface, on which devices in process are positioned, while the dispenser is in a ready position and not actually delivering adhesive, and to withdraw from the interposed position as, or immediately before the needle tip descends to a dispensing position to deposit adhesive on a device. In this way, drops of adhesive that fall from the needle tip while in the ready position are captured by the shutter and prevented from falling onto a device in process in an unintended location of the device.

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