BONDING METHOD,申请号JP20100263785-传众专利搜索

BONDING METHOD

申请公布号：JP2012111898(A)

申请号：JP20100263785

申请日期：2010.11.26

申请公布日期：2012.06.14

申请人：

YOKOHAMA RUBBER CO LTD:THE;DAIHATSU MOTOR CO LTD

发明人：ARAKI KIMINORI;YOSHIDA NANA

分类号：C09J5/06;C09J11/06;C09J175/06;C09J201/00

主分类号：C09J5/06

摘要：<P>PROBLEM TO BE SOLVED: To provide a bonding method enabling short-time movement of a bonded structure, and heating of the bonded structure. <P>SOLUTION: This method includes: a warming step in which at least either of a main agent containing a crystallizable polymer and a curing agent is allowed to contain a crystallizing agent having a melting point of M, and at least either of the main agent and the curing agent is warmed up to a temperature of ≥(melting point M-10)°C; a mixing step in which the main agent and the curing agent are mixed together; a bonded structure forming step in which an adhesive is applied onto at least one of a plurality of adhesion objects, and a bonded structure is formed by laminating the adhesion objects; and a bonded structure heating step in which the bonded structure is heated. <P>COPYRIGHT: (C)2012,JPO&INPIT