Adhesive on wire stacked semiconductor package,申请号US20100927533-传众专利搜索

Adhesive on wire stacked semiconductor package

申请公布号：US8143727(B2)

申请号：US20100927533

申请日期：2010.11.16

申请公布日期：2012.03.27

申请人：

OH KWANG SEOK;PARK JONG WOOK;PARK YOUNG KUK;MIN BYOUNG YOUL;AMKOR TECHNOLOGY, INC.

发明人：OH KWANG SEOK;PARK JONG WOOK;PARK YOUNG KUK;MIN BYOUNG YOUL

分类号：H01L23/12;H01L23/48;H01L21/60;H01L23/02;H01L23/13;H01L23/16;H01L23/28;H01L23/31;H01L23/52;H01L25/065;H01L29/40

主分类号：H01L23/12

摘要：A semiconductor package and a method of producing the same has a substrate. A first semiconductor chip is coupled to a surface of the substrate. The first semiconductor chip has a first and second surfaces which are substantially flat in nature. An adhesive layer is coupled to the second surface of the first semiconductor chip. A second semiconductor chip having first and second surfaces which are substantially flat in nature is further provided. An insulator is coupled to the first surface of the second semiconductor chip for preventing shorting of wirebonds. The second semiconductor chip is coupled to the adhesive layer by the insulator coupled to the first surface thereof.