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LIGHT EMITTING DEVICE PACKAGE

申请公布号:KR20120021592(A)

申请号:KR20100076823

申请日期:2010.08.10

申请公布日期:2012.03.09

申请人:
SAMSUNG LED CO., LTD.

发明人:OH, SUNG KYONG;KIM, HYUNG KUN;PAEK, HO SUN;CHUNG, SUK HO

分类号:H01L33/50

主分类号:H01L33/50

摘要:PURPOSE: A light emitting device package is provided to prevent the re-absorption of a fluorescent substance by forming the distance between a light-emitting device chip and a photo converter by 2-17times of the height of the light-emitting device chip. CONSTITUTION: A main body member(110) comprises a cavity(112). A light-emitting device chip(120) is mounted within the cavity. A photo converter(140) is formed in order to cover the cavity. The photo converter comprises a fluorescent layer more than a first floor. The distance between the photo converter and the light-emitting device chip is 2-17times of the height of the light-emitting device chip. A lens part is arranged on the upper side of the main body member. An UV reflective part reflects UV light emitted from the light-emitting device chip.

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