ELECTROCHEMICAL DEVICE AND CIRCUIT BOARD,申请号JP20100093400-传众专利搜索

ELECTROCHEMICAL DEVICE AND CIRCUIT BOARD

申请公布号：JP2011222902(A)

申请号：JP20100093400

申请日期：2010.04.14

申请公布日期：2011.11.04

申请人：

TDK CORP

发明人：HASEGAWA HIROAKI;ITO HIDETAKA;OHASHI YOSHIHIKO;KATAI KAZUO;MIYAKI YOSUKE

分类号：H01G9/004;H01G2/06;H01G9/008;H01G11/10;H01G11/66;H01G11/74;H01G11/78;H01M2/10;H01M2/30

主分类号：H01G9/004

摘要：<P>PROBLEM TO BE SOLVED: To provide an electrochemical device capable of improving fixing strength between an electrode pad and a lead, with high connection reliability. <P>SOLUTION: In the electrochemical device, a lead 3 includes: a lead body 3A including Al; a metal thin film 3a which is provided at the tip of the lead body 3A, folded into a curved shape with side face positions of the lead body 3A as a boundary so that voids are formed between the side faces of the lead body 3A and itself, covers upper and lower faces and side faces of the lead body 3A, and has a predetermined region welded to the lead body 3A. The metal thin film 3a includes a thin film body 3a1 containing Ni, and a plated layer 3a2 which covers at least an external surface of the folded thin film body 3a1 and contains Sn. Specific regions R3U, R3L on an inner surface of the folded thin film body 3a1 and the surface of the lead body 3A directly come into close contact with and welded to each other in the predetermined region R3U, R3L without the intermediary of the plated layer 3a2. <P>COPYRIGHT: (C)2012,JPO&INPIT