HOLDER FOR SEMICONDUCTOR WAFER, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER,申请号JP20100021367-传众专利搜索

HOLDER FOR SEMICONDUCTOR WAFER, AND METHOD OF PROCESSING SEMICONDUCTOR WAFER

申请公布号：JP2011159866(A)

申请号：JP20100021367

申请日期：2010.02.02

申请公布日期：2011.08.18

申请人：

SHIN ETSU POLYMER CO LTD

发明人：ODAJIMA SATOSHI

分类号：H01L21/683;H01L21/301

主分类号：H01L21/683

摘要：PROBLEM TO BE SOLVED: To provide a holder for a semiconductor wafer and a method of processing the semiconductor wafer, which do not need transfer of the semiconductor wafer onto a dicing tape of a dicing frame, simplifying and speeding up the work. SOLUTION: The holder has a heat-resistant adhesive sheet 10 covering the hollow portion of a grip 1, and detachably adheres to and holds a thin semiconductor wafer W on the surface of the adhesive sheet 10. A reinforcing layer 20 is adhered to the back side of the adhesive sheet 10 before dicing. Since the reinforcing layer 20 is laminated on the adhesive sheet 10 for reinforcement, the tool for a semiconductor wafer used in a solder reflow process is directly usable in the dicing process. It is therefore unnecessary to transfer the semiconductor wafer W onto a dicing tape of a dicing frame of exclusive use before dicing, thereby preventing the work from being complicated, troublesome, delayed, etc. COPYRIGHT: (C)2011,JPO&INPIT