大功率白光发光二极管的封装方法
申请公布号:CN101350383B
申请号:CN200710043965.9
申请日期:2007.07.18
申请公布日期:2011.08.17
发明人:孟世界
分类号:H01L33/00(2006.01)I
主分类号:H01L33/00(2006.01)I
代理人:翟羽
地址:315400 浙江省余姚市西南街道工业功能区
摘要:一种大功率白光发光二极管的封装方法,包括下列步骤:提供一基座,该基座具有一收容芯片的凹陷部;提供一垂直出光型芯片,该芯片包括衬底和发光体,所述衬底具有一凹槽,所述发光体收容于所述凹槽内并固定在所述凹槽的底面上,所述发光体的出光面与所述凹槽的内壁围合成一收容荧光粉的荧光粉收容空间;将荧光粉填充满所述收容空间,且使荧光粉层上表面与所述衬底上端面平齐;覆盖封装材料于该基座上方。本发明通过将荧光粉直接填充于芯片出光面上方设置的一荧光粉收容空间内,并使形成的荧光粉层上表面与所述芯片衬底上端面平齐,大幅度提高了大功率白光发光二极管所发出光的均匀性。
主权项:一种大功率白光发光二极管的封装方法,包括下列步骤:提供一基座,该基座具有一收容芯片的凹陷部;提供一垂直出光型芯片,该芯片包括衬底和发光体,所述衬底具有一凹槽,所述发光体收容于所述凹槽内并固定在所述凹槽的底面上,所述发光体的出光面与所述凹槽的内壁围合成一收容荧光粉的荧光粉收容空间;将所述发光体的宽度与所述凹槽的宽度相当设置,使得发光体侧壁与凹槽的内壁紧贴配置;将荧光粉填充满所述收容空间,且使荧光粉层上表面与所述衬底上端面平齐;覆盖封装材料于该基座上方。
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