MOUNTING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC MODULE,申请号WO2010JP04380-传众专利搜索

MOUNTING APPARATUS AND MANUFACTURING METHOD OF ELECTRONIC MODULE

申请公布号：WO2011061873(A1)

申请号：WO2010JP04380

申请日期：2010.07.05

申请公布日期：2011.05.26

申请人：

SONY CHEMICAL & INFORMATION DEVICE CORPORATION;HAMAZAKI, KAZUNORI

发明人：HAMAZAKI, KAZUNORI

分类号：H05K3/34;H01L21/60;H05K3/32

主分类号：H05K3/34

摘要：<p>Provided is a mounting apparatus, wherein a plurality of electronic parts having different types of electrodes are mounted onto a substrate all at once. The mounting apparatus comprises a heating unit that heats electrodes of a first electronic part and a second electronic part among a plurality of electronic parts, a heat radiation section that lets heat be radiated from the electrodes of the first electronic part and the second electronic part, a first heat conduction member provided between the heating unit or the heat radiation section and the electrode of the first electronic part, and a second heat conduction member provided between the heating unit or the heat radiation section and the electrode of the second electronic part. The amount of heat to be conducted per unit time by the first heat conduction member and the second heat conduction member are different.</p>