WIRING BOARD AND SEMICONDUCTOR DEVICE,申请号JP20110023844-传众专利搜索

WIRING BOARD AND SEMICONDUCTOR DEVICE

申请公布号：JP2011091448(A)

申请号：JP20110023844

申请日期：2011.02.07

申请公布日期：2011.05.06

申请人：

KYOCERA CORP

发明人：NISHIKAWA HIROYUKI;TANAHASHI SHIGEO;HAYASHI KATSURA

分类号：H01L23/12;H01L23/50;H05K1/18;H05K3/46

主分类号：H01L23/12

摘要：<P>PROBLEM TO BE SOLVED: To connect a decoupling capacitor, which suppresses variation of a power supply voltage and a grounding potential inside a semiconductor integrated circuit element, to a semiconductor integrated circuit element and a wiring board, with low resistance and low inductance. <P>SOLUTION: In a wiring board, a build-up layer 130a which is formed by laminating a wiring conductor layer 132 and an insulating layer 131 alternately is formed in at least one side of main surfaces of a core substrate 110, and a cavity 120 for accommodating a chip-type decoupling capacitor 121 is formed in the build-up layer 130a. The capacitor 121 includes electrode terminals on an upper surface thereof that are directly connected to a semiconductor component 260, and electrode terminals on a lower surface of the capacitor 121 is connected to a wiring conductor layer 132a on a bottom surface of the cavity 120. This structure enables decoupling capacitor 121 and the semiconductor component 260 to be connected with low resistance and low inductance. <P>COPYRIGHT: (C)2011,JPO&INPIT