SUBSTRATE TREATMENT APPARATUS,申请号JP20090223665-传众专利搜索

SUBSTRATE TREATMENT APPARATUS

申请公布号：JP2011077064(A)

申请号：JP20090223665

申请日期：2009.09.29

申请公布日期：2011.04.14

申请人：

DAINIPPON SCREEN MFG CO LTD

发明人：YAMASHITA EIJI;JODAI KAZUO

分类号：H01L21/306

主分类号：H01L21/306

摘要：PROBLEM TO BE SOLVED: To reduce the frequency of exchange of an etching liquid in a substrate treatment apparatus for applying etching treatment to a substrate. SOLUTION: The substrate treatment apparatus 1 for applying etching treatment to a substrate 9 having a silver thin film formed on a glass substrate includes a treatment chamber 11 for reserving the etching liquid, a substrate supporting section 12 for supporting the substrate 9 arranged in parallel in the treatment chamber 11, and an absorbent cartridge 13 opposing a top surface 91 of the substrate 9 in the treatment chamber 11. The absorbent cartridge 13 has a sheet-like absorbent 131 and is immersed in the etching liquid together with the substrate 9 so that a silver ion generated by the etching treatment for the top surface 91 of the substrate 9 can be absorbed by the absorbent 131. Thus, an increase in density of metal ions in the etching liquid is suppressed, a metal ion in the etching liquid is prevented from being reduced and precipitated to the substrate 9, and a frequency of exchange of the relatively expensive etching liquid is reduced. COPYRIGHT: (C)2011,JPO&INPIT