一种氢氧化镍薄膜电极及其制备方法
申请公布号:CN102005571A
申请号:CN201010286111.5
申请日期:2010.09.19
申请公布日期:2011.04.06
发明人:张正富;杨伦权;陈庆华;杨晓梅
分类号:H01M4/48(2010.01)I;H01M4/04(2006.01)I
主分类号:H01M4/48(2010.01)I
代理人:金耀生
地址:650093 云南省昆明市五华区学府路253号
摘要:本发明涉及一种氢氧化镍薄膜电极及其制备方法。将经过处理的钛基片作为阴极,放在以硼酸溶液为缓冲液、以硫酸镍溶液为电镀液的溶液中,用脉冲电流进行电镀镍。再以电镀了镍膜的钛基片作为阳极,以泡沫镍作为阴极,放在碱性溶液中,进行电化学阳极氧化,即可获得氢氧化镍薄膜电极。本发明制备的氢氧化镍薄膜电极内阻较小,比电容量较大,且该制备方法简单实用,成本低廉。
主权项:本发明涉及的氢氧化镍薄膜电极按以下方法制备:第一步:取一直径为10~20mm、厚度为1~3mm的圆形钛片表面打磨、抛光处理后放到按硝酸与盐酸1∶3配比的王水里浸泡1小时,接着,在60~100℃温度下保温0.5~3小时后,冷却取出,再打磨抛光两面,作为基片;第二步:将处理过的钛基片作为阴极,放在以硼酸溶液浓度3g/L~60g/L为缓冲液,以硫酸镍溶液浓度20g/L~200g/L为电镀液的溶液中进行电镀,电镀液pH=1.0~5.0,电镀时,脉冲电压幅值为20~50V,电压频率为:180~300Hz,电镀时间为:0.1~2.0小时,得到钛基片表面的致密镍镀层;第三步:以电镀了镍膜的钛基片作为阳极,泡沫镍作为阴极,放在氢氧化钾2~10mol/L溶液中,进行电化学氧化,氧化温度:25~80℃,氧化时间:1~4小时,氧化电压:0.7~1.2V,即获得薄膜厚度小于100μm的氢氧化镍薄膜电极。
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