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Dissipating heat within housings for electrical components

申请公布号:GB2474141(A)

申请号:GB20100019279

申请日期:2008.06.27

申请公布日期:2011.04.06

申请人:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

发明人:LEE ATKINSON

分类号:G06F1/20;G06F1/16

主分类号:G06F1/20

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