Herstellungsverfahren für eine elektronische Vorrichtung,申请号DE20076011881T-传众专利搜索

Herstellungsverfahren für eine elektronische Vorrichtung

申请公布号：DE602007011881(D1)

申请号：DE20076011881T

申请日期：2007.11.20

申请公布日期：2011.02.24

申请人：

FUJITSU LTD.

发明人：KOBAYASHI, HIROSHI

分类号：H05K1/18;H05K3/30

主分类号：H05K1/18

摘要：A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive (13) on a surface of a base (11) having a conductive pattern (112) formed on a film (111); mounting a circuit chip (12) on the base (11) through the thermosetting adhesive (13); holding the base (11) while pressing a circuit chip side of the base and a film side of the base by a heating apparatus that heats the thermosetting adhesive; giving a tension to the base on which the circuit chip is mounted; and heating the thermosetting adhesive by the heating apparatus to cure the thermosetting adhesive, thereby fixing the circuit chip to the conductive pattern.