Semiconductor device interconnect systems and methods,申请号US20070674733-传众专利搜索

Semiconductor device interconnect systems and methods

申请公布号：US7884485(B1)

申请号：US20070674733

申请日期：2007.02.14

申请公布日期：2011.02.08

申请人：

FLIR SYSTEMS, INC.

发明人：BARTON JEFFREY B.;SALAZAR DIANE M.;DURHAM JOSEPH H.

分类号：H01L23/48;H01L21/00

主分类号：H01L23/48

摘要：Systems and methods are disclosed for forming interconnects between semiconductor devices in accordance with one or more embodiments of the present invention. For example, a method of forming interconnects between semiconductor devices includes depositing a plurality of first contacts on a plurality of corresponding first pads of a first semiconductor device; forming a plurality of plated contacts on a plurality of corresponding second pads of a second semiconductor device; aligning the plurality of first contacts with the plurality of plated contacts; and joining the plurality of first contacts to the plurality of plated contacts to form the interconnects between the first semiconductor device and the second semiconductor device.