申请公布号：JP4625769(B2)

申请号：JP20060015346

申请日期：2006.01.24

申请公布日期：2011.02.02

分类号：G03F7/023;C08G69/00;G03F7/004;H01L21/027

主分类号：G03F7/023

摘要：A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.

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