LED package comprising leadframe and two-part heatsink and method of manufacturing the same,申请号EP20030790215-传众专利搜索

LED package comprising leadframe and two-part heatsink and method of manufacturing the same

申请公布号：EP1568076(B1)

申请号：EP20030790215

申请日期：2003.12.03

申请公布日期：2011.01.26

申请人：

CREE, INC.

发明人：LOH, BAN, P.

分类号：H01L21/44;H01L25/075;H01L33/00;H01L33/48;H01L33/62;H01L33/64

主分类号：H01L21/44

摘要：<p>Light emitting die package (10) is disclosed. The die package (10) includes a leadframe (20), a bottom heatsink (30), a top heatsink (40), a reflector (60) and a lens (70). The top and bottom heatsinks (40 and 30) are thermally coupled but electrically insulated from the leadframe (20). The leadframe (20) includes a plurality of leads (22) and defines a mounting pad (28) for mounting LEDS (50). The top heatsink (40) defines an opening (42) over the mounting pad (28). The reflector (60) is coupled to the top heatsink (40) at the opening (42). The lens (70) is placed over the opening (42) defining an enclosed cavity (44) over the mounting pad (28). At least one light emitting diode (50) is mounted on the mounting pad (28) within the cavity (44). Encapsulant optically couples the LED (50) to its surrounding surfaces to maximize its optical Performance. When energized, the LED (50) generates light and heat. The light is reflected by the reflector (60) and operated on by the lens (70). The heat is dissipated by the top and the bottom heatsinks (40 and 30).</p>