IN-MOLD MOLDING METHOD AND IN-MOLD MOLDING DIE,申请号JP20100084727-传众专利搜索

IN-MOLD MOLDING METHOD AND IN-MOLD MOLDING DIE

申请公布号：JP2011000880(A)

申请号：JP20100084727

申请日期：2010.04.01

申请公布日期：2011.01.06

申请人：

PANASONIC CORP

发明人：MIYAZAKI MASAMITSU;KADORIKU SHINJI

分类号：B29C45/16;B29C33/14

主分类号：B29C45/16

摘要：PROBLEM TO BE SOLVED: To provide an in-mold molding method by which the picture of an in-mold transfer foil can evenly be stuck.SOLUTION: A foil pressing elastic body 135 which is formed of an elastic body is installed on a foil pressing frame 105 which is confronted with the part surface 104a of a first die 104 in order to press down the in-mold transfer foil 103. A recess section 114 is installed on the part surface 104a in the feeding direction of the in-mold transfer foil 103, and the end section is firmly pinched by the wedge effect of a thinner section 145 which comes into contact with the in-mold transfer foil 103 and the part surface 104a, and a thicker section 155 which is inserted in the recess section 114. Then, the width direction of the in-mold transfer foil 103 is pinched by the part surface 104a and the surface of the thicker section 155. Thus, the generation of wrinkles on the picture, and the breakage of the picture in a molded article can be prevented.