CURABLE COMPOSITION AND CURED PRODUCT,申请号JP20090143464-传众专利搜索

CURABLE COMPOSITION AND CURED PRODUCT

申请公布号：JP2011001401(A)

申请号：JP20090143464

申请日期：2009.06.16

申请公布日期：2011.01.06

申请人：

KANEKA CORP

发明人：FUJIWARA MASAHIRO;HONGO SHINYA

分类号：C08L83/05;C08F265/06;C08G77/388;C08K5/3477

主分类号：C08L83/05

摘要：PROBLEM TO BE SOLVED: To provide a curable composition having excellent molding property and high heat resistance, transparency and strength, and to provide a cured product.SOLUTION: The curable composition and a cured product of the composition comprise an organic compound containing a carbon-carbon double bond having reactivity with an SiH group, a hydrosilylation catalyst, an SiH group-containing silicon compound, and polymer fine particles in a size of 10 to 500 nm having a specified structure. The polymer fine particles are preferably prepared by polymerizing 20 to 97 mass% of a (meth)acrylate having at least one aromatic ring in the molecule, 2 to 10 mass% of a (meth)acrylate having at least one cyclic ether structure in the molecule, 1 to 6 mass% of a polyfunctional monomer, 0 to 77 mass% of other (meth)acrylates, and 0 to 27 mass% of other vinyl monomers, in total 100 mass%.