SUPPORT MEMBER FOR PLATE-LIKE MEMBER,申请号JP20090134641-传众专利搜索

SUPPORT MEMBER FOR PLATE-LIKE MEMBER

申请公布号：JP2010283098(A)

申请号：JP20090134641

申请日期：2009.06.04

申请公布日期：2010.12.16

申请人：

LINTEC CORP

发明人：NAKADA MIKI;YAMAGUCHI KOICHI

分类号：H01L21/683;H01L21/02;H01L21/304

主分类号：H01L21/683

摘要：PROBLEM TO BE SOLVED: To provide a support member for a plate-like member capable of uniformly grinding the plate-like member such as a wafer to an extremely thin thickness by being stuck to the plate-like member, and capable of being easily released from the plate-like member without the use of large-scale equipment. SOLUTION: The support member 10 includes a body 11 for supporting the semiconductor wafer W by being stuck to one surface of the semiconductor wafer W through a double-sided adhesive sheet A. A weak adhesion treatment surface 13 is formed t an outer edge side of a surface to which the double-sided adhesive sheet A is stuck in the body 11. The weak adhesion treatment surface 13 is formed of a protruded and recessed surface or formed by using a forming body 15 constituted by a member different from a member constituting the body 11. COPYRIGHT: (C)2011,JPO&INPIT