ELECTROCONDUCTIVE FILM PATTERN AND METHOD FOR FORMING AN ELECTROCONDUCTIVE FILM PATTERN,申请号WO2010JP58415-传众专利搜索

ELECTROCONDUCTIVE FILM PATTERN AND METHOD FOR FORMING AN ELECTROCONDUCTIVE FILM PATTERN

申请公布号：WO2010134536(A1)

申请号：WO2010JP58415

申请日期：2010.05.19

申请公布日期：2010.11.25

申请人：

KONICA MINOLTA HOLDINGS, INC.;YANATA ATSURO

发明人：YANATA ATSURO

分类号：H01B5/14;H01B13/00;H05K3/10;H05K3/38

主分类号：H01B5/14

摘要：<p>Disclosed are an electroconductive film pattern and a method for forming the same, in which an electroconductive film pattern having superior variations in film thickness and surface planarity, and satisfactory adhesion to a substrate is formed without the need for complex and expensive equipment and processes. The electroconductive film pattern is formed by placing ink containing fine metallic particles on a substrate and carrying out sintering, and the ink exhibits positive (or negative) zeta potential. A primer layer having a negative (or positive) charge is formed on the surface of the substrate where the ink is placed.</p>