HEAT-PEELABLE TYPE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND CUT-PROCESSING METHOD OF LAMINATED CERAMIC SHEET,申请号JP20100042353-传众专利搜索

HEAT-PEELABLE TYPE ADHESIVE SHEET FOR CUTTING LAMINATED CERAMIC SHEET AND CUT-PROCESSING METHOD OF LAMINATED CERAMIC SHEET

申请公布号：JP2010229399(A)

申请号：JP20100042353

申请日期：2010.02.26

申请公布日期：2010.10.14

申请人：

NITTO DENKO CORP

发明人：SOEJIMA KAZUKI;HIRAYAMA TAKAMASA;SHIMOKAWA DAISUKE;SATO MASAAKI;ARIMITSU YUKIO

分类号：C09J201/00;C09J5/08;C09J7/02;C09J133/00;H01G13/00

主分类号：C09J201/00

摘要：PROBLEM TO BE SOLVED: To provide a heat-peelable type adhesive sheet for cutting a laminated ceramic sheet which displays an adequate adhesion in cut processing under atmosphere of a normal or high temperature and is easily peelable by heating in peeling. SOLUTION: The heat-peelable type adhesive sheet for cutting the laminated ceramic sheet has a constitution in which a thermal expansion adhesive layer is formed on at least one surface of a substrate, is used as a temporary fixation in cutting the laminated ceramic sheet, and also a gel fraction of the thermal expansion adhesive layer is 50 wt.% or above and a glass transition temperature of the thermal expansion adhesive layer is -40 to 30°C. A base polymer of an adhesive forming the thermal expansion adhesive layer is preferably an acrylic polymer. The adhesive forming the thermal expansion adhesive layer preferably contains a crosslinking agent, further. COPYRIGHT: (C)2011,JPO&INPIT