APPEARANCE INSPECTION APPARATUS AND APPEARANCE INSPECTION METHOD OF SOLDERED REGION,申请号JP20090043238-传众专利搜索

APPEARANCE INSPECTION APPARATUS AND APPEARANCE INSPECTION METHOD OF SOLDERED REGION

申请公布号：JP2010197252(A)

申请号：JP20090043238

申请日期：2009.02.25

申请公布日期：2010.09.09

申请人：

YAMATAKE CORP

发明人：KANEHARA KEIJI

分类号：G01N21/956

主分类号：G01N21/956

摘要：<P>PROBLEM TO BE SOLVED: To accurately determine the quality of a solder fillet formed in an abutting section between printed boards and having a L-shaped inspected region by using a conventional method. Ž<P>SOLUTION: An appearance inspection apparatus includes: a line light source 11 for irradiating the abutting section between the printed boards with a linear light; a camera 12, inclined with respect to a line for connecting the line light source and the abutting section between the printed boards at an angle, and disposed on a bisector having a start point as an intersection between one side and the other side in the L-shaped soldered region as the object to be inspected, and is equiangular to the sides; an image input means; image processing means 212, 213 for processing an image as a section image of a land portion by a light-section method; an inspection parameter extracting means 214 for extracting the inspection parameters, including a shape feature parameter and a location parameter for implementing a soldered region quality inspection based on the section image; a soldered region quality determining means 221 for determining the soldered region quality based on the inspection parameters; and an output means 222 for outputting the determined result. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž