LEAD-FREE TIN ALLOY ELECTROPLATING COMPOSITION AND METHOD THEREOF

申请公布号：JP2010174373(A)

申请号：JP20100000141

申请日期：2010.01.04

申请公布日期：2010.08.12

申请人：

ROHM & HAAS ELECTRONIC MATERIALS LLC

发明人：LUO YU;BROWN NEIL D;TOBEN MICHAEL P

分类号：C25D3/32;C25D5/50

主分类号：C25D3/32

摘要：<p><P>PROBLEM TO BE SOLVED: To provide a lead-free tin alloy electroplating composition and a method thereof. <P>SOLUTION: The electrolyte composition for depositing tin alloy on a base body contains tin ion, one or more ions of alloy forming metals, a flavone compound and dihydroxy bis-sulfide. The electrolyte composition free of lead and no cyanate compound. A method for depositing the tin alloy on the base body and a method of forming a mutual connection bump on a semiconductor element are disclosed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>

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