PRINTED WIRING BOARD AND CONNECTION METHOD OF ELECTRONIC COMPONENT IN THE SAME,申请号JP20080307320-传众专利搜索

PRINTED WIRING BOARD AND CONNECTION METHOD OF ELECTRONIC COMPONENT IN THE SAME

申请公布号：JP2010135375(A)

申请号：JP20080307320

申请日期：2008.12.02

申请公布日期：2010.06.17

申请人：

SUMITOMO ELECTRIC PRINTED CIRCUIT INC

发明人：UNEKI YU;HOTTA TAKASHI;HIROSE TOMOKANE

分类号：H05K3/34

主分类号：H05K3/34

摘要：PROBLEM TO BE SOLVED: To provide a printed wiring board smoothly dissipating flux constituents and the like separated and discharged from a solder paste via a land part to prevent an electronic component from moving when the electronic component is connected to the printed wiring board. SOLUTION: In the printed wiring board including an insulating base material, a conductor layer laminated to the insulating base material, and an insulation coating layer to cover the conductor layer, land parts 4 corresponding to connection electrodes 6 on the lower surface of the electronic component 2 are arranged by forming the conductor layer into a predetermined pattern, and the electronic component is connected through a paste type solder applied to the land parts. The printed wiring board includes an escape space 5, which is formed to face the land parts and/or a clearance 8 between the land parts and can store a component separated and discharged from the paste type solder. COPYRIGHT: (C)2010,JPO&INPIT