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METHOD OF FABRICATING PRINTHEAD ASSEMBLY
申请公布号：US2010147445(A1)
申请号：US20080334520
申请日期：2008.12.15
申请公布日期：2010.06.17
发明人：LEE SEUNG JIN;WILLIAMS SUSAN;WASZCZUK JAN;SILVERBROOK KIA
分类号：B32B43/00
主分类号：B32B43/00
摘要：A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.