SOLDER PASTE DISPENSER FOR A STENCIL PRINTER,申请号IL20070180720-传众专利搜索

SOLDER PASTE DISPENSER FOR A STENCIL PRINTER

申请公布号：IL180720(A)

申请号：IL20070180720

申请日期：2007.01.15

申请公布日期：2010.06.16

申请人：

SPEEDLINE TECHNOLOGIES, INC.

摘要：A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position beneath the stencil, and a dispensing head coupled to the frame in such a manner that the dispensing head is configured to traverse the stencil during first and second print strokes. The dispensing head includes a frame assembly and a wiper blade assembly, coupled to the frame assembly, having first and second wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The first and second wiper blades are constructed and arranged to force solder paste through the apertures of the stencil. The dispensing head further includes a dispensing unit, coupled to the frame assembly, having a chamber adapted to dispense solder paste, the dispensing unit being disposed between the first and second wiper blades to deposit solder paste therebetween. A method for printing solder paste on a substrate is further disclosed.