HEAT SINK ASSEMBLY

申请公布号：US2010128442(A1)

申请号：US20090464519

申请日期：2009.05.12

申请公布日期：2010.05.27

申请人：

HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD;HON HAI PRECISION INDUSTDRY CO., LTD

发明人：WU ZHI-PING;WANG XIAO-FENG;LIN YU-HSU;WU JENG-DA;CHAO CHIH-HANG

分类号：H05K7/20

主分类号：H05K7/20

摘要：A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base.

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